Friday, June 29, 2001

Technical details

Plenty of space has been left open around the CPU socket, which should allow for the installation of large heatsinks.

The memory slots are located far enough from the AGP port that there is little chance of a retention bar coming into contact with the graphics card.

Five 4700Mfds and six 2200Mfds capacitors have been installed around the CPU socket.

The voltage regulation circuits are of the triple phase variety.

The CPU retention mechanism employed by the TH7 is far superior to that of the DB850GB reference board, and can be manipulated with ease.

Three fan connectors are included, and all of them are controlled by the hardware monitoring system.

It's possible to manually assign IRQs.

The AGP port does not support AGP Pro graphics cards.

An integrated HighPoint HPT370 RAID controller is included.

An alphanumeric LED diagnostic panel is present.

An extra thermal sensor connector is present, with a thermal sensor included in the package.

An Intel 82559 PCI network controller is available as an option.

Finally, in order to facilitate service, two interruptors have been installed on board. One serves to power-on the system (JP5), and another to reboot (JP6).

Suite: Additional Features